Spin coating

Spin coating

Enduction centrifuge

L'enduction centrifuge (plus connue sous son nom anglais de spin coating) est une technique de déposition de film fin sur des surfaces planes en micro-électronique.

Le substrat, un wafer de semi-conducteur en général, est posé et maintenu par du vide sur un plateau tournant à haute vitesse constante, afin de d'étaler le matériau déposé (sous forme liquide) de façon uniforme par force centrifuge. La machine utilisée pour cette opération est appelée spin coater ou spinner en anglais.

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